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Mezzanine interconnect delivers 28+ Gbps signal integrity

17 May 2012

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Molex Inc. has launched a new modular NeoScale mezzanine interconnect system that is capable of achieving optimal signal integrity at data rates of 28+Gbps. Designed primarily for printed circuit board (PCB) mezzanine applications in enterprise networking towers and telecommunication hubs and servers, the NeoScale mezzanine interconnect features a patent-pending triad wafer configuration. The configuration isolates each differential pair for optimal performance and customization. Other applications are in industrial controllers and medical and military high data-rate scanning equipment.

Explains Adam Stanczak, product development manager at Molex, "The modular NeoScale triad comprises three pins per differential pair—-two signal pins and one shielded ground pin. Each triad is a standalone 28Gbit/s differential pair with no additional ground pins required and can be optimized for high speed single ended or power systems as well." He adds: "The highly flexible and robust NeoScale mezzanine interconnect offers exceptionally clean signal transmission and signal integrity compared to other mezzanine connectors available in the mezzanine connector market today."

NeoScale mezzanine interconnect

The honeycomb construction of the NeoScale mezzanine interconnect housing routes each triad to minimize crosstalk and effectively route out of the PCB in one or two layers. Designers therefore save on the cost of PCB material. In addition, unique tombstone structures located in the connector housing protect the mating interface and flexible contacts to help prevent damage to the terminals. NeoScale features a density of 82 differential pairs per square inch. Its layout can be customized with high speed differential pairs, high speed single ended traces, low speed single ended lines and power contacts. It is available with 85Ω and 100Ω impedance, and mated stack height range of 12mm to 40mm. Its design options include 6 to 30 circuit column sizes with 2, 4, 6 and 8 row options available, ranging from 12 to 240 triads in one assembly.

The NeoScale mezzanine interconnect deploys patented Molex Solder Charge Technology as an attachment method for PCB termination. More cost-effective and reliable than a ball grid array connector attachment method, the mechanical SMT process simplifies designs. It also facilitates strong solder joints in volume manufacturing by eliminating the need for thermal attachment and complex forms in the solder tail.

The NeoScale plug assembly, meanwhile, features a 2.80mm pitch between differential pairs. The receptacle assembly pin includes polarization and keying features. The ground pin has two SMT attachment points, with four solder charge joints per triad. The PCB footprint does not change when mixing and matching the different differential pair, high speed single-ended and power triads within the housing. The orientation of the NeoScale plug and receptacle provides a mirrored configuration with a dividing line of back-to-back shields. The resulting mirror line bisects the triad pair to facilitate PCB routing and RX/TX pin-out management for optimal signal integrity and mechanical stability. Durable molded construction further protects against handling damage and provides optimized signal integrity and mechanical stability.




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