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Embedded component package tech boosts PCB design-thru-mfg

29 May 2012

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Mentor Graphics Corp. have partnered with AT&S that presents its Embedded Component Package (ECP) process for Mentor Graphics PCB design-through-manufacturing flow. AT&S' indicated that its advanced ECP technology for microelectronic component packaging leverages embedded bare die and discrete passives into the core of a PCB, reducing the package form factor by 30-50 percent for improved functionality and system performance.

Now, with the Mentor Expedition Enterprise flow, designers are able to implement AT&S' advanced technology on their PCB cores up to 40 percent faster and with improved quality than with previous design tools, said the company. As a result, PCB designers using ECP technology will realize improved electrical performance, thermal management, miniaturization, cost efficiency and overall product quality, with significant time reduction, added the firm.

AT&S has worked with Mentor Graphics to develop a streamlined design workflow for embedded active components into the core of a PCB. This is an emerging technology that has drawn great interest from semiconductor companies. Since embedding active components is relatively new to PCB and package design, it does present challenges to the traditional design flow. As well, Mentor provides a complete PCB design-through-manufacturing flow with its integrated Valor manufacturing and assembly software tools.

Mentor and AT&S have found dramatic time savings using Mentor Graphics PCB design tools with the ECP technology. A recent design project comprised a complex package module with two embedded flip-chip die and, on top of the substrate, a stacked die along with another flip-chip die. This would normally require ten working days to setup, design and output for manufacturing. However, using the Mentor-AT&S integrated technology, product development was achieved in just six days; this also enabled the inclusion of thermal vias using the Mentor FloTHERM tool for thermal analysis.

The Mentor Graphics Expedition Enterprise platform with the ECP technology will be released later this year.




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