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Multitest customizes plating process for BGAs, WLCSPs

24 Aug 2012

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A Pulse Plating Process from Multitest offers improvements in fabrication and cycle time and has been released to manufacturing for all major board customers. The process was originally developed to support ultra-high aspect ratio requirements at 0.4 mm pitch.

Multitest has developed a customized plating process for small via diameters in high layer count PCBs used in ATE tests. The process allows for .0051" diameter through-holes into PCBs with up to 40 layers.

The Multitest Pulse Plating Process is particularly suitable for BGAs and WLCSPs and for vertical probe applications. It eliminates the need for sequential lamination in most 0.4mm pitch applications. This same technology is deployed for 0.3mm pitch BGA applications with through-hole construction.




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