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SpeedStack connector system ready for network apps

05 Feb 2013

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Molex has recently debut the SpeedStack mezzanine connector system. The company's latest product is a high-density, low-profile connector that comes in a variety of circuit sizes and supports data rates of up to 40Gbit/s per differential pair.

Mated stack heights of 4.00 mm to 10.00 mm, along with a 0.80-mm pitch, make SpeedStack useful for applications with limited PCB real estate, such as telecommunications, networking, medical and consumer electronics, and military components.

Offering a high-density signal solution with flexible pin counts, SpeedStack gives designers a choice of sizes ranging from 22 to 120 circuits with 6 to 32 differential pairs. The 100-Ω design of the connector provides good impedance control. Molex expects to release an 85-Ω version in June that will support PCIe Generation 3.0 and Intel QuickPath Interconnect requirements for next-generation I/O and memory signalling. SpeedStack has insert-moulded wafers with a protective shrouded housing for improved electrical balance and a common ground pin to help minimise crosstalk.

SpeedStack connector datasheet

Datasheet for the SpeedStack connector can be found here.

Visit molex at www.molex.com .




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