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Molex headers save PCB space

11 Apr 2013

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The HS Stac headers have recently been released by Molex Inc. The 0.80mm pitch headers are modular, stackable and they also combine the Stac64 connector system with the USCAR-30 HSAutolink interface.

"Expanding in-vehicle functionality means increasing terminal requirements for devices and modules," says Laurent Stickeir, global product manager, Molex. "Customers wanting to use or already using the Stac64 system for I/O connections can now use HS Stac headers to create custom, ganged multi-bay headers, combining I/O with high-speed signal without expensive tooling investment. In addition to cost savings and simplified assembly, this allows customers greater design flexibility and saves application space."

The automotive industry-standard interface, known as USCAR-30, supports USB 2.0 requirements and other high-speed technologies, including low voltage differential signalling (LVDS) and Ethernet for infotainment, telematic devices, car stereo and navigation systems, and driver-assist electronic modules. HS Stac right-angle headers package the USCAR-30 interface found in the Molex HSAutoLink family in a rugged, shroud-stackable formation compatible with the widely deployed Molex Stac64 header family. This design creates a unique multi-bay, high-speed connection system to meet growing in-vehicle terminal requirements for devices and modules in automotive and commercial transportation applications.

HS Stac headers mate with a range of existing HSAutoLink cable assemblies for a complete connection solution. For additional information visit: www.molex.com/link/hsstac.html.




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