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Pad conditioner targets wafer fabrication

09 May 2013

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 Morgan Advanced Materials pad conditioners

Advanced materials supplier Morgan Advanced Materials will be launching its Diamonex Phoenix Edge pad conditioner at the SEMICON Singapore 2013 on 7th-9th May 2013 at Marina Bay Sands Expo, Singapore. Diamonex Phoenix Edge is a designed for some of the most demanding chemical mechanical polishing (CMP) applications such as wafer fabrication at 32nm.

The dimensional stability, high purity, corrosion resistance and excellent surface integrity of Morgan's advanced ceramic materials ensure reliable performance in the harsh environment of the fabrication chamber.

The technology behind Diamonex Phoenix Edge produces the highly consistent fine pad texture required for the advanced process nodes. It also produces CMP pads with significantly smaller asperities and more consistent pad texture than pad conditioners utilising traditional diamond crystals or grit.

Because contact is made by the edges of precisely-machined elevated surfaces coated with CVD diamond, rather than diamond grit, the new pad conditioners provide consistent performance in all regions of the pad, throughout the long life of each conditioner and from conditioner to conditioner.

Constructed of an engineered ceramic substrate and coated with Diamonex CVD diamond coating, the Phoenix Edge pad conditioners are an engineered solution for controlling pad texture. The edges can be arranged in spiral or concentric patterns, with specifically-engineered dimensions, to produce the required pad texture that will optimise CMP performance for each application.




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