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Mentor to integrate Calibre 3DSTACK into Tezzaron's 3D-IC

22 May 2013

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Mentor Graphics Corp. and Tezzaron Semiconductor Corp. have teamed up to integrate the Calibre 3DSTACK product into Tezzaron's 3D-IC offerings. According to the companies, the new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying individual dies in the usual manner, while verifying die-to-die interfaces in a separate procedure with specialised automation features.

Tezzaron works with industry, academia and government to create advanced 3D-ICs. Their offerings include wafer stacking and die stacking technology with TSVs, Bi-STAR built in self-test and repair circuitry for continuous error detection and recovery, and extremely fast memory devices for both stand-alone and stacked applications.

Complementing Tezzaron's 3D-IC design capabilities, the Calibre 3DSTACK signoff solution provides DRC, LVS and parasitic extraction (PEX) capabilities. It verifies physical offset, rotation and scaling at the die interfaces. It also enables connectivity tracing and extraction of interface parasitic elements needed for multi-die performance simulation.

The Calibre 3DSTACK product is a fully compatible extension to the standard Calibre signoff platform, so it can be easily added to existing verification flows to support flexible stacking configurations of multiple dies, including dies based on different technologies or process nodes.




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