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TDK chip bead series fits into 0603 case

24 May 2013

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TDK multilayer chip beads

A miniaturised multi-layer chip bead series has been launched by TDK Corp. The MMZ0603-E series fits into a case size 0603 (EIA 0201), which is 80% smaller than the MMZ1005-E types.

The new MMZ0603-E series of multi-layer chip beads combines compact dimensions of just 0.6 x 0.3 x 0.3 mm3 with excellent electrical characteristics. The MMZ0603-E series is currently available in two high-impedance versions, one rated for 600Ω and the other for 1000Ω at 100MHz. Both types offer even higher impedance values at 1GHz of 1000Ω and 1800Ω, respectively.

Thanks to its good impedance values, a single component can cover a very wide frequency range, ensuring highly efficient noise attenuation. The MMZ0603-E multi-layer chip bead is therefore very well suited for eliminating noise in compact mobile devices, especially in smartphones that must operate with multiple communication frequency bands.

The significant advance in the miniaturisation of chip beads was made possible by TDK's Gigaspira production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals. Mass production started in February 2013.




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