Path: EDN Asia >> News Centre >> IC/Board/Systems Design >> STATS ChipPAC taps NTU for semiconductor packaging R&D
IC/Board/Systems Design Share print

STATS ChipPAC taps NTU for semiconductor packaging R&D

15 Aug 2013

Share this page with your friends

Semiconductor packaging and test services company STATS ChipPAC Ltd. is teaming up with Nanyang Technological University in Singapore for research and development of new products related to wafer level packaging and interconnect technologies.

"We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

The partnership is in full alignment with STATS ChipPAC's on-going commitment to Singapore as the Company's global hub for advanced wafer level technology research and development, and Post Wafer fab Process (PWfP) for advanced mobile convergence devices.




Want to more of this to be delivered to you for FREE?

Subscribe to EDN Asia alerts and receive the latest design ideas and product news in your inbox.

Got to make sure you're not a robot. Please enter the code displayed on the right.

Time to activate your subscription - it's easy!

We have sent an activate request to your registerd e-email. Simply click on the link to activate your subscription.

We're doing this to protect your privacy and ensure you successfully receive your e-mail alerts.


Add New Comment
Visitor (To avoid code verification, simply login or register with us. It is fast and free!)
*Verify code:
Tech Impact

Regional Roundup
Control this smart glass with the blink of an eye
K-Glass 2 detects users' eye movements to point the cursor to recognise computer icons or objects in the Internet, and uses winks for commands. The researchers call this interface the "i-Mouse."

GlobalFoundries extends grants to Singapore students
ARM, Tencent Games team up to improve mobile gaming


News | Products | Design Features | Regional Roundup | Tech Impact