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Spectre XPS FastSPICE simulator boasts faster throughput

11 Oct 2013

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Cadence Design Systems is helping manufacturers shorten simulation from weeks to days for large and complex chip designs with its new Spectre XPS FastSPICE simulator. Showcased at the CDNLive India 2013, the extensive partitioning simulator delivers throughput up to 10 times faster than rival products while consuming two to three times less memory.

Spectre XPS helps designers to accurately measure timing while including the impact of IR drop, making it ideal for advanced-node, low-power mobile designs that require high performance, accuracy and a greater capacity for post-layout verification. It helps companies save on support costs by allowing the easy re-use of models, stimulus, analysis and overall methodology.

The unified Spectre simulation platform spans SPICE, advanced SPICE, RF and FastSPICE, enabling easy transition across analysis and flows. Spectre XPS integrates into the Virtuoso Analog Design Environment for mixed-signal design, and into the Liberate MX memory characterisation tool for SRAM memory characterisation.

The faster throughput of Spectre XPS lets design teams conduct more thorough and accurate simulations for large memory-intensive designs, as well as low-power architectures that require greater visibility into parasitics.




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