Path: EDN Asia >> Product Centre >> Consumer Electronics >> TI makes MCSDK available on OMAP-L138 DSP + ARM9 devices
Consumer Electronics Share print

TI makes MCSDK available on OMAP-L138 DSP + ARM9 devices

14 Nov 2013

Share this page with your friends

Texas Instruments has made its multi-core software development kit (MCSDK) available on the low-power OMAP-L138 and OMAP-L132 DSP + ARM9 processors. The company said the kit will allow developers to reduce development time and scalability to TI's TMS320C6000 digital signal processors (DSPs). The move may benefit clients involved in the industrial, communications, telecom, and medical markets.

TI's MCSDK provides optimised bundles of foundational, platform-specific drivers to enable development on TI's devices. Providing well-defined application programming interfaces for ease of programming, the MCSDK supports future portability to higher performance TI multi-core platforms so that customers do not have to develop common layers from scratch. The MCSDK gives developers the ability to evaluate hardware and software capabilities of the device-specific development platforms and to rapidly develop multi-core applications. In addition, it enables applications to use SYS/BIOS and/or Linux on one platform. Typically, the MCSDK individual cores can be assigned to operate Linux applications as a control plane, while other cores are simultaneously assigned signal processing operations. This heterogeneous configuration provides software developers the flexibility to implement full solutions on TI's multi-core processors. In the case of TI's OMAP-L138, the internal ARM9 processor can be assigned with a high-level operating system, such as embedded Linux, performing complex IO stack handling, while the TMS320C647x DSP runs TI RTOS (previously SYS/BIOS) real-time processing tasks.

"We are very excited to have the MCSDK available for the OMAP-L138 processor," said Ramesh Kumar, business manager, DSP at TI. "New and existing customers will enjoy many benefits, including the ability to use the same software across TI's C6000 DSPs, enabling programming efficiency, improved time to market, and a greater return on investments made today."

The MCSDK contains libraries that are compatible with TI's C647x DSPs and KeyStone-based DSPs, including the C665x, C667x, 66AK2Hx, and 66AK2Ex processors. With the MCSDK, developers are able to access and benefit from various optimised DSP libraries, including the Math Library, Digital Signal Processing Library, Image and Video Processing Library, Telecom Libraries, and Speech and Video Codecs. In addition, TI's OMAP-L138 processor includes a combination of application-tuned features and peripherals, including Ethernet, USB, SATA, Video Port Interface (VPIF), uPP, and more.

The MCSDK also gives developers access to the latest Linux software updates through the community open-source kernels.

TI's MCSDK for the OMAP-L138 processor can be downloaded for free on TI.com. The OMAP-L138 LCDK (TMDXLCDK138) development kit is available for $195.00 through the TI eStore or through distribution partners.




Want to more of this to be delivered to you for FREE?

Subscribe to EDN Asia alerts and receive the latest design ideas and product news in your inbox.

Got to make sure you're not a robot. Please enter the code displayed on the right.

Time to activate your subscription - it's easy!

We have sent an activate request to your registerd e-email. Simply click on the link to activate your subscription.

We're doing this to protect your privacy and ensure you successfully receive your e-mail alerts.


Add New Comment
Visitor (To avoid code verification, simply login or register with us. It is fast and free!)
*Verify code:
Tech Impact

Regional Roundup
Control this smart glass with the blink of an eye
K-Glass 2 detects users' eye movements to point the cursor to recognise computer icons or objects in the Internet, and uses winks for commands. The researchers call this interface the "i-Mouse."

GlobalFoundries extends grants to Singapore students
ARM, Tencent Games team up to improve mobile gaming


News | Products | Design Features | Regional Roundup | Tech Impact