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Imec, Besi R&D pact to focus on thermocompression bonding

22 Jan 2014

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Research firm Imec and equipment supplier Besi announced that they intend to work together over research and development of a high-throughput thermocompression solution for narrow-pitch die-to-die and die-to-wafer bonding. The companies hope the thermocompression bonder will give way to the production of hybrid 3D, 2.5D and 2.5D/3D technology.

Advancement in 3D IC manufacturing has been hampered by the lack of a high-throughput automated process flow for narrow-pitch, high-accuracy die-to-die and die-to-wafer bonding. Flip chip and reflow soldering, which are currently combined for bonding, require lenient bonding accuracy on large bump pitches (around 150µm-50µm bump pitch). Bump pitches need to further scale down to 40µm-10µm to realise a sufficiently high performance. This needs high accuracy in bonding within the range of 1um-2um @3sigma. Thermocompression bonding is a method that enables this high bonding accuracy on narrow bump pitches, but it entails long cycle times due to temperature and pressure profiles and processing methods. Besi and Imec's partnership intends to address this obstacle.

"This collaboration will enable us to benchmark our Chameo tool to meet the industrial needs of the semiconductor industry, offering our customers a viable and effective solution for 2.5D/3D IC manufacturing," said Richard Blickman, CEO at Besi.




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