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Molex launches backplane connector in 6 configurations

24 Jan 2014

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The Impact 100Ohm modular backplane connector from Molex operates at a maximum data rate of 25Gbit/s to support high speed networking devices and storage servers used in industries ranging from aerospace to telecommunications. Designed with a 1.90mm x 1.35mm pitch, the connector is compliant with IEEE 10GBASE-KR and OIF Stat Eye Compliant end-to-end channel performance standards.

With a 1.90mm x 1.35mm grid, which reduces PCB routing complexity and cost, the broad-edge coupled, differential-pair Impact backplane system supports high bandwidth needs while minimising board and system real estate usage. Compliant pin attach options (0.39mm and 0.46 mm) provide the flexibility to optimise designs for superior mechanical and electrical performance in traditional backplane or midplane architectures. The Impact daughtercard mating interface uses an in-line staggered, bifurcated contact system that reduces the mating force per pin and provides ground-signal sequencing without the need for multiple backplane signal-pin heights. The product has a signal density up to 80 differential pairs per linear inch when using a 6-pair configuration.

Available in conventional, coplanar, mezzanine, orthogonal and orthogonal direct configurations, signal module options vary by configuration and are offered in two to six 6 pairs. Power modules are available in three to six pair sizes in conventional, coplanar and mezzanine configurations with current ratings from 60A to 120A per module.




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