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Understanding moulded interconnect devices

11 Feb 2014  | Shane Stafford

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Moulded interconnect devices (MIDs) are 3-dimensional electromechanical parts that marry the best of both mechanical and electrical engineering. MIDs combine the circuit board, housing, connectors, and cables that comprise traditional product interfaces and merge them into one fully functional, compact part.

The appeal of a device such as the MID is easily recognised. By reducing the amount of parts that go into a product, space is saved, fewer components are necessary, and the weight of the unit is reduced. In addition, the possibility of a 3D workspace lets engineers think outside of the square geometries that have previously limited circuit board design.


Figure 1: A moulded interconnect device used in an automotive user interface.


Originally developed in the 1980s, MIDs came on strong as a hot, new concept. Despite the early fanfare, however, MIDs didn't catch on at first. High tooling costs and high volume manufacturing thresholds limited the market for MIDs. Before long, it appeared that the moulded interconnect device was nothing more than flash in the pan technology.

All that has begun to change since the turn of the century, as MIDs have seen a comeback. The original touted benefits of MIDs—saving space, reducing weight, limiting part count—haven't changed, but their importance has risen as the trend of miniaturisation continues its march forward.

The classic Motorola "brick" cell phone as made famous by Oliver Stone's Wall Street may not have had much use for miniature parts, but the smart phone in your pocket that doubles as your computer, personal assistant, GPS, and gaming device sure does.

As functionality of electronics has increased, we've demanded that their size does the opposite. In short, technology has evolved but the size of our hands hasn't. For this reason, we've reached a point in time where, more than ever, electrical and mechanical product designers must be on the same page as far as making everything work in the limited space modern devices possess.

Fortunately for development teams, modern manufacturing methods make implementing MIDs a more pragmatic option than before. Amongst these methods are insert moulding and hot stamping, but the two most widely used processes are two-shot moulding and laser direct structuring. Two-shot moulding was the first manufacturing method to provide cost-effective production of highly repeatable interconnect devices. It involves the use of two separate plastic parts, one platable and one non-platable.

The platable part, usually palladium doped plastic, forms the circuitry. The non-platable part, often polycarbonate, fulfills mechanical functions and completes the moulding. The two parts are fused together and then undergo electroless plating. In this step the platable plastic is metallized, while the non-platable plastic remains non-conductive.

Due to the nature of having multiple parts, tooling for the two-shot moulding process is often complex. With the device's circuit design tied to the moulding of the two plastics, flexibility for late cycle design changes is limited. These two factors make two-shot moulding ideal for producing MIDs with simple electrical designs set for very large manufacturing quantities.

Another method for producing MIDs is laser direct structuring (LDS). A three-step process (patented by LPKF), laser direct structuring builds on the benefits introduced by two-shot moulding.


The laser direct structuring process
Laser direct consists of three basic steps: injection moulding, laser activation, and metallisation. With LDS, only a single thermoplastic material is required to make an MID, making the moulding step a one-shot process. Having only one part means that the circuitry is created on the plastic itself, one of the distinct features of LDS. The second step of the LDS process is laser activation. Here a physiochemical reaction occurs that etches the wiring pattern onto the part and prepares it for metallisation.

In order for LDS to work as intended, the part moulded in step one must be made from an LDS grade material. Available from most major plastics suppliers, these materials are variants of common plastics, such as nylon or acrylonitrile-butadiene-styrene (ABS), that are doped with a metal-organic compound.

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