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Sensor signal conditioning IC combines 24bit DSP

11 Sep 2014

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Expanding its family of sensor signal conditioning ICs, Zentrum Mikroelektronik Dresden AG (ZMDI) has introduced an 18bit sensor signal conditioning (SSC) IC with an integrated 24bit digital signal processor (DSP). The ZSSC3218 supports linearisation and calibration functions and is optimised for high-resolution industrial, consumer, and medical applications.

The ZSSC3218 has a power-save scheme to lower overall current consumption, internal filter options for low-noise output signals as well as alarm and interrupt features. The IC is well-suited for applications in harsh environments as it includes an internal supply regulator with a power supply rejection ratio (PSRR), eliminating the need for an external buffer capacitor.

Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an internal correction algorithm with coefficients stored on-chip in a highly reliable, nonvolatile, multiple-time programmable memory. The ZSSC3218's serial interface with the PC-controlled calibration software provided in the development kit eases programming. The measured and corrected bridge values are provided at the digital output pins as I2C or SPI. The ZSSC3218 can also provide a corrected temperature output measured with an internal sensor.

With an almost noise-free 18bit output signal, the ZSSC3218 allows designs for high-precision measurement systems, including barometric altitude measurement for portable navigation or emergency call systems, altitude measurement for car navigation, pressure measurements inside hard disks and weather forecasting equipment. The device can also adopt thermopile sensors to enable contactless temperature measurements of objects or human body temperature.

"The ZSSC3218 is designed for use with resistive pressure sensors as well as absolute voltage sensors such as thermopiles," said Michael Georgi, Product Marketing Manager at ZMDI. "A new application is contactless temperature measurement based on thermopile sensors in mobile devices."

The ZSSC3218 is in full production and is available as die for wafer bonding. The device is priced at $1.20 per unit in 50,000 pieces.




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