Path: EDN Asia >> Product Centre >> Automotive >> Arteris sol'n aims to deliver resilient, fault tolerant SoCs
Automotive Share print

Arteris sol'n aims to deliver resilient, fault tolerant SoCs

06 Oct 2014

Share this page with your friends

Arteris Inc., which claims to be the inventor and only supplier of silicon-proven commercial network-on-chip (NoC) interconnect IP solutions, has unveiled the FlexNoC Resilience Package that promises to boost the reliability and reduce the cost of developing resilient and fault tolerant SoCs. The latest release is geared to improve the benefits of Arteris FlexNoC network-on-chip fabric IP to automotive, aerospace defence, industrial equipment and other electronics markets requiring fault tolerance, the company indicated.

The creation of the FlexNoC Resilience Package is based on experience: For many years, companies such as Mobileye (in the EyeQ3 ADAS SoC), Texas Instruments (in various designs) and Renesas Electronics (in industrial and automotive designs) have used the existing Arteris FlexNoC product in fault tolerant SoCs.

Key features of the FlexNoC Resilience Package include unit protection by duplication and redundancy, similar to dual-core lockstep (DCLS) and required for ASIL B, C or D systems as specified in the automotive ISO 26262 standard; duplicate unit checkers and fault safety controller; built in self-test (BIST) for resilience functions; data protection by monitoring; data packet integrity checkers; and easy partitioning of any SoC into resilient and non-resilient domains.

"The market for electronic controls in vehicles is in a revolutionary phase demanding new robust graphical user interfaces similar to our tablets and smartphones but without increasing distraction," said Tom Hackenberg, automotive embedded processors principal analyst for IHS Technology. "Simultaneously, OEMs must maintain robust safety with features like advanced driver assistance systems (ADAS). With the demand for media-rich and telematics head unit processors quadrupling in the next five years, the OEM's challenge is merging the fast-paced design of the high-performance SoC solutions common to the wireless market with the time-consuming intense ISO26262 and ASIL certified MCU and microprocessors that have continued to provide us with safe and reliable control systems. While it is common to design separate electronic control units, this can increase cost and potentially create additional driver distraction."

"To provide OEMs and their system suppliers with a choice, incumbent and emerging suppliers are developing new ways to provide both a rich user experience and mission critical certification," Hackenberg continued. "A growing number are turning to safety- and security-optimised network-on-chip subsystems for SoCs, such as the FlexNoC Resilience Package, to lower the development costs and time it takes to achieve the ISO 26262 certification, enabling both media-intense processing and certifiable mission critical solutions in an integrated SoC."

The FlexNoC Resilience Package is available. It is a companion product to Arteris FlexNoC.




Want to more of this to be delivered to you for FREE?

Subscribe to EDN Asia alerts and receive the latest design ideas and product news in your inbox.

Got to make sure you're not a robot. Please enter the code displayed on the right.

Time to activate your subscription - it's easy!

We have sent an activate request to your registerd e-email. Simply click on the link to activate your subscription.

We're doing this to protect your privacy and ensure you successfully receive your e-mail alerts.


Add New Comment
Visitor (To avoid code verification, simply login or register with us. It is fast and free!)
*Verify code:
Tech Impact

Regional Roundup
Control this smart glass with the blink of an eye
K-Glass 2 detects users' eye movements to point the cursor to recognise computer icons or objects in the Internet, and uses winks for commands. The researchers call this interface the "i-Mouse."

GlobalFoundries extends grants to Singapore students
ARM, Tencent Games team up to improve mobile gaming


News | Products | Design Features | Regional Roundup | Tech Impact