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1.2kV smart power modules improve industrial motor design

18 Nov 2014

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Fairchild Semiconductor has announced its latest 1.2kV smart power modules (SPM) that boast critical power management silicon components to help minimise board space and heat sink sizes, resulting in a compact, all-in-one solution for up to 7.5kW, high-voltage designs. Geared for customers building high-voltage industrial applications, the devices claim to enable simple and reliable design, extremely high thermal performance and full protection for systems using large 3-phase inverter motors for high energy efficiency.

The company used the same direct bonding copper (DBC) packaging technologies originally developed for space applications to deliver a junction-to-case thermal resistance that is 15 per cent lower than competing solutions. It also improves overall system reliability for much smoother motor control functions in products such as industrial-grade heating, ventilation and air conditioning equipment, as well as pumps and factory automation systems.

In a single rugged package, the Motion SPM 2 series for 1.2kV 3-phase inverter designs with currents of up to 35A features 1.2kV NPT trench IGBTs, bootstrap diodes, low-voltage and high-voltage driver ICs, NTC thermister and a full protection suite.




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