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MEMSensing, SMIC roll out 'smallest' 3-axis accelerometer

13 Jan 2015

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MEMSensing Microsystems Co. Ltd. and Semiconductor Manufacturing International Corporation (SMIC) have launched what they claim to be the world's smallest commercial 3-axis accelerometer. The MSA330 utilises SMIC's CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies.

By vertically integrating the 3-axis accelerometer device with CMOS ASIC into a single package of 1.075mm3x1.075mm3x0.60mm3 (LxWxH), MSA330 achieves about 30 per cent shrink in footprint and 70 per cent reduction in the total size compared to the latest commercial products. It is also the thinnest of its kind, only 0.5mm after SMT and 0.6mm in total height including 0.2mm solder balls. According to the company, the MSA330 would be competitive not only in overall fabrication costs through all wafer level fabrication and packaging but also in miniaturisation particularly for mobile and wearable applications.

"We plan to allocate more resources to cooperate with SMIC to develop other advanced products and make an effort to further enrich China's domestic MEMS industry chain," said Dr. Li Gang, CEO of MEMSensing.




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