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Dev't modules compatible with USB 3.0 SuperSpeed

11 Sep 2015

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FTDI Chip has announced a family of evaluation/development modules to boost wider utilisation of its next generation USB interfacing technology. The company's FT600/1Q USB 3.0 SuperSpeed line-up is backed up by the UMFT60XX offering, and is made of four models that claim to provide different FIFO bus interfaces and data bit widths.

Through these modules operational parameters of FT600/1Q devices can be fully assessed and interfacing with external hardware undertaken, such as FPGA platforms from other suppliers, stated the company.

UMFT600A, <p>UMFT601A

Measuring 78.7mm x 60mm, the UMFT600A and UMFT601A each have a high speed mezzanine card (HSMC) interface with 16bit and 32bit wide FIFO buses respectively. TheUMFT600X and UMFT601X have dimensions of 70mm x 60mm and incorporate field-programmable mezzanine card (FMC) connectors, again with 16bit and 32bit wide FIFO buses, respectively. The HSMC interface is compatible with most Altera FPGA reference design boards, while the FMC connector delivers the same functionality in relation to Xilinx boards.

Fully compatible with USB 3.0 SuperSpeed (5Gb/s), USB 2.0 High Speed (480Mb/s) and USB 2.0 Full Speed (12Mb/s) data transfer, the UMFT60xx modules support two parallel slave FIFO bus protocols with an achievable data burst rate of around 400MB/s. The multi-channel FIFO mode can handle up to four logic channels. It is complemented by the 245 synchronous FIFO mode, which is optimised for more straightforward operation.

The T600/1Q USB 3.0 SuperSpeed ICs are in full volume production.




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