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iPhone 6s teardown reveals design win for Knowles

02 Oct 2015  | Peter Clarke

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According to a teardown of a unit performed by engineering consultants Chipworks, the list of components that make up the iPhone 6s is similar to that of the iPhone 6 and 6 Plus. Bosch Sensortec and InvenSense retained the places they won for inertial MEMS sensors in the iPhone 6 and 6 Plus.

In terms of microphones Goertek has retained its place while AAC has lost three slots to Knowles.

Chipworks has said it will do separate teardowns and analyses of the camera and the touch screen systems.

In several areas, most notably the application processor, Chipworks said Apple is dual sourcing. So, as expected both Samsung and TSMC are providing versions of the Apple A9. The APL0898 from Samsung with a die size of 96mm2 is slightly smaller than the APL1022 from TSMC, which has a die size of 104.5mm2. Both are in the respective foundries FinFET process. In the case of Samsung this is nominally a 14nm FinFET and in the case of TSMC 16nm FinFET.

Apple A9 application processor

Apple A9 application processor as made by TSMC in the APL1022. Source: Chipworks

Apple A9 processors

Relative die sizes for Samsung- and TSMC-made Apple A9 processors. Source: Chipworks

Also Chipworks found a 16Gb SDRAM from Micron Technology in the phone while referencing another teardown specialist iFixit finding Samsung as the supplier for the same component. Similarly the 128Gb flash memory is from SK Hynix in Chipwork's teardown but was supplied by Toshiba for iFixit.

Also Chipworks found a 16Gb SDRAM from Micron Technology in the phone while referencing another teardown specialist iFixit finding Samsung as the supplier for the same component. Similarly the 128Gb flash memory is from SK Hynix in Chipwork's teardown but was supplied by Toshiba for iFixit.

Chipworks' partial bill of materials for iPhone 6s

BOM for iPhone 6s

BOM for iPhone 6s




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