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Novel concept of WICOP products eliminates need for packaging

07 Oct 2015

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Seoul Semiconductor has developed a novel product based on the concept of wafer level integrated chip on PCB (WICOP) LEDs. According to the company, this technology does not need processes such as die bonding or wire bonding, which are necessary for conventional LED package production nor does it contain major LED package component parts such as lead-frame, or gold wire.

Wicop2 for lighting

New product of Wicop2 for lighting (Z8Y15 width and length of with 1.5mm each)

WICOP is a totally new concept for an LED product that has overcome the limits posed by the existing CSP solutions. Seoul Semiconductor succeeded in developing and producing the product for the first time in the world in 2012, said the company. As it is designed to directly connect the chip to PCB, there is no need for packaging processes such as die bonding or wire bonding. In addition, as there is no intermediate substrate, the size of the chip and package is 100 per cent the same. It is characterised by the super small size and high efficiency. It is also good for the high luminance and thermal conductivity.

In the case of the widely available product TOP LED, a variety of equipment is required for the production such as die bonding machines to attach the chip to the lead frame, wire bonding machines to connect electrodes to the gold wire, as well as material in the product itself such as lead frame, gold wire and adhesives required in each process. Due to this packaging process a conventional LED results in a package size larger than the actual chip size, and so is space limited as the size of the chip could not be made smaller to meet specification requirements.

CSP technology, derived from silicon, is a technology developed to minimise the size of semiconductor parts (package) to the size of a chip. Generally, when the size of the package does not exceed more than 1.2 times the chip, it is classified as CSP. This technology was applied to the LED industry and companies, they announced products using this technology in 2012. However, as products using this technology need die bonding equipment, intermediate substrate or ceramic and silicon material to attach the chip to the PCB, it is difficult to see the technology as a complete CSP.

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