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Novel concept of WICOP products eliminates need for packaging

07 Oct 2015

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Comparison of LED production process: General LED, CSP, WICOP

General LED package

General LED package

CSP: Use of intermediate substrate between chip and PCB

CSP: Use of intermediate substrate between chip and PCB

Wicop: Direct connection between chip and PCB

Wicop: Direct connection between chip and PCB

Seoul Semiconductor was the first to introduce to the world a complete concept of WICOP products in which the size of the package (PKG) is the same as that of chip, and does not use other costly materials by directly attaching the chip to the PCB, said the company. It started to mass produce relevant products and supply them to client companies, thus firmly establishing its position as the leading company in the industry. Also, it secured global patents in respect to WICOP and succeeded in constructing a technological entry barrier.

Since 2013, WICOP has been supplied to main customers for use in LCD backlights and camera flashes, as well as in head lamps of vehicles. With the release of an LED package WICOP2 for use for lighting applications, Seoul Semiconductor has been able to possess a WICOP product portfolio applicable to all fields of the LED industry.


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