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STATS ChipPAC strengthens presence in Singapore

01 Feb 2012

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STATS ChipPAC has recently started constructing a new factory in Singapore, which will focus on wafer-level technologies including embedded wafer-level ball grid array (eWLB), wafer-level chip scale packaging (WLCSP), integrated passive devices (IPD), and through silicon via (TSV). The new 197,000sq ft building will be located next to the company's existing factory in Yishun, and will expand the company's current manufacturing base to 792,000sq ft.

Scheduled to start operations by Q4 2012, the new facility will allow STATS ChipPAC to further expand its capacity in advanced packaging and testing solutions. Wafer-level packaging has been one of the highest growth segments in the semiconductor industry with demand outpacing the available market capacity.

STATS ChipPAC also revealed that it had invested approximately $250 million for the expansion of its technology offerings and manufacturing capacity in Singapore. Another $220 million will be poured into the Singapore operations in coming years.

"Advanced wafer-level technologies are essential to support our customers' requirements for increased performance and functionality for sophisticated mobile devices such as smartphones and tablets," said Tan Lay Koon, president and CEO, STATS ChipPAC.

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