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UMC succeeds with 55nm SDDI tape-out

21 Dec 2012

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Taiwan-based semiconductor foundry United Microelectronics Corp. (UMC) has recently announced that it has successfully taped out a customer product 55nm SDDI (small display driver IC) process technology. UMC claims the 55nm SDDI process is a foundry industry breakthrough, which enables smartphones to feature full-HD resolution.

Yau Kae Sheu, senior director of UMC's 12-inch Speciality Technology Development division, said, "This world-leading 55nm SDDI process nicely complements our comprehensive display driver technology portfolio. With our volume production 0.13um and our recently introduced new generation 80nm SDDI technologies, customers now have the flexibility to design into a full range of smartphone resolutions depending on their application, including WVGA, qHD, HD720/WXGA, and now Full-HD, fully covering smartphone display requirements from 3.5 inches to larger than 5 inches."

The 55nm SDDI process features a tiny SRAM size of 0.4µm2 and provides an ideal balance of power consumption, performance, and chip size for integration into high-end Full-HD smartphones that demand low power and a slim profile. 55nm SDDI customer products will be manufactured using advanced 300mm wafer technology, with fast manufacturing cycle to fit customer time-to-market needs. The 55nm process leverages UMC's world leading position in SDDI, with over 300 million SDDI chips shipped for today's mainstream smartphones.




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