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Lithography process refined with SpectraShape 9000

06 Mar 2013

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 SpectraShape 9000

Semiconductor equipment manufacturer KLA-Tencor has recently unveiled the SpectraShape 9000 optical critical-dimension metrology system and the BDR300 backside-defect inspection and review module. The two devices enable volume production of integrated circuits at sub-20nm design rules.

The products will aid manufacturers in dealing with tight process tolerances in lithography and etch by focusing on two key issues: scanner focus-related defects and failure or underperformance of finFETs, vertically stacked NANDs, and other three-dimensional structures caused by small deviations in shape.

The SpectraShape 9000 introduces a laser-driven plasma light source that has higher intensity and lower noise than its predecessor. It also employs several optical techniques that enable the measurement of a broad range of materials and complex device structures.

The BDR300 backside inspection and review module for the CIRCL cluster tool also improves defect sensitivity over its predecessor, allowing fabs to find and classify subµm backside defects. The CIRCL cluster is now available as a stand-alone backside inspection and review system.

The product page for the SpectraShape 9000 metrology system can be found here.

The CIRCL cluster tool product page can be accessed here.




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