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Ascentech outs Aprotec SPI measurement systems

18 Apr 2013

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Aprotec Z-Check

The availability of the Aprotec Z-Check family of solder paste inspection and measurement systems has recently been announced by Aprotec distributor Ascentech LLC. These are non-contact benchtop SPI measuring systems designed for PCB assembly and production.

From the innovative Z-Check 3D through to the entry level Z-Check 100, the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z-check software comes with the convenience of a full SPC package as standard.

The Z-Check 3D system is the latest addition to the successful Z-check family. It provides a large scanning area and unique 5-line LED scanning in addition to all the major features of this well established bench top solder paste inspection system.

The Z-Check 900S, the top of the range 2D system employs a large capacity motorized stage with "teach and learn" positioning software, laser pointer as standard and automatic Z axis measurement.

The best-selling Z-Check 600/600S features greater measurement capacity utilising Aprotec's Maglok table, integrated controls, automatic Z axis measurement and a laser pointer option.

The Z-Check 100 offers a low cost solution to PCB quality control with automatic Z axis measurement using a manually positioned Friction Free Glide stage.

The Z-Check CP50 Co-Planetary Inspection system provides the means by which visual inspection and accurate assessment of an IC package can greatly reduce or eliminate the risk of dry jointing or component failure.

In addition to the measurement of rectangular and square pads, all 2D Z-Check systems can assess the geometric properties of angles, circles, and irregular shapes.

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