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Infineon, Globalfoundries team up for eFlash process tech

02 May 2013

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Infineon Technologies and Globalfoundries Inc. have entered a technology development and production agreement for 40nm embedded flash (eFlash) process technology. According to the firms, the team up will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security MCUs with 40nm process structures.

"Next generation embedded Flash MCUs with 40nm process structures will further enhance our competitive strength in the automotive as well as chip card and security markets," noted Arunjai Mittal, member of the management board of Infineon. "We trust in Globalfoundries with their excellent manufacturing background and sites on different continents to fulfil Infineon's stringent quality, infrastructure security and business continuity requirements."

"Infineon's decision to choose Globalfoundries as the foundry partner for the 40nm embedded Flash technology node recognises our unique ability to offer one-foundry-solutions supported by multiple fabs in different geographies," said Ajit Manocha, CEO Globalfoundries. "We are committed to providing leading-edge technology and manufacturing capabilities required to support Infineon's business. We are looking forward to a long-term collaboration with Infineon and to contribute to their success in a very dynamic industry."

This agreement with Globalfoundries is consistent with Infineon's strategy to engage in technology co-development for CMOS-based technologies in 65nm and below. Process and product qualification for security MCUs is planned for 2H15. Automotive microcontroller production start is scheduled for 1H17.

Production of the next generation 40nm eFlash MCUs will take place at different Globalfoundries sites, initially in Singapore with subsequent transfer to its site in Dresden, Germany.




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