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Broadcom unveils 5G WiFi combo chips

28 May 2013

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A series of 5G WiFi combination chips have recently been unveiled by Broadcom Corp. The BCM43162 and BCM4339 are designed for notebooks, PCs, smartphones and tablets.

Broadcom's 5G WiFi technology is currently powering the recently launched Samsung Galaxy S4 smartphone and HTC One smartphone. Additionally, the company's 5G WiFi is integrated into select LG Digital TVs and the ASUS ROG G75VW gaming laptop, as well as routers from Belkin, Buffalo, Cisco, D-Link, Edimax, NETGEAR, Samsung and Tenda. Broadcom today extends that leadership with its single-chip 5G WiFi products for mass market devices.

As Broadcom's second generation of 5G WiFi combo chips, the BCM43162 and BCM4339 offer the same unmatched performance, range and power consumption benefits as the flagship 5G WiFi combo chip, the BCM4335, but integrate the complete front-end, power amplifier (PA) and Low Noise Amplifier (LNA), to enable a low-cost, mass market solution.

The BCM43162 is a peripheral component interconnect express-based (PCIe) client solution for PCs and notebooks with support for Microsoft Windows operating system, and the BCM4339 with secure digital input output (SDIO) interface, is a mobility solution for smartphones and tablets with support for Microsoft Windows and Android operating systems.

Additional features

  • Integrated 5G WiFi PA and LNA technology to allow small form factor designs and reduced total BOM
  • Transmit beamforming and low-density parity-check (LDPC) codes for greater coverage and robust whole-house media and data applications
  • 433Mbit/s Wireless Local Area Network (WLAN) PHY rate for superior speed
  • Broadcom proprietary TurboQAM for 33% increase in 2.4GHz speed
  • Broadcom proprietary Channel Smoothing WLAN PHY to increase receiver sensitivity by an average of 2db across 802.11n and 802.11ac rates
  • Specific to the BCM4339, Broadcom is the only vendor to offer Long Term Evolution (LTE) coexistence

Broadcom's BCM43162 and BCM4339 are now sampling with early access customers with volume production expected in 2H 2013.

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