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STATS ChipPAC expands SG operations with new facility

30 May 2013

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PWfP is an emerging business area between the front-end wafer foundries which create silicon wafers and the OSAT providers that handle back-end packaging and test. PWfP includes advanced wafer level processes such as wafer thinning, micro bumping and redistribution that are increasingly important factors in delivering innovative semiconductor packaging solutions. With a strong focus on PWfP, STATS ChipPAC has established a leadership position in the industry with a comprehensive platform of wafer level technology solutions that include Fan-in Wafer Level Packaging (FIWLP), Fan-out Wafer Level Packaging (FOWLP), Integrated Passive Devices (IPD) and Through Silicon Via (TSV).

With the development of PWfP and the rapid growth expected in wafer level technology, STATS ChipPAC plans to expand its Singapore workforce, including its professional, managerial, executive and technical (PMET) positions, by 12 per cent in 2013 over its current workforce of approximately 2,500 employees in Singapore. Singapore residents represent 54 per cent of the STATS ChipPAC Singapore workforce and 84 per cent of its PMET positions. STATS ChipPAC has approximately 10,000 employees in eight countries worldwide.

"Today represents an exciting step forward in the accelerated growth of our Singapore operation. The successful workforce skills expansion, productivity and research programmes we have established in partnership with our local labour movement and government agencies will ensure our company is well positioned to meet the complex and demanding requirements of leading edge mobile technology," said Wan Choong Hoe, executive vice president and chief operating officer, STATS ChipPAC.

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