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Low-cost interposer initiative targets 2.5 ICs

31 May 2013

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An initiative composed of Singapore's A*STAR Institute of Microelectronics (IME), Qualcomm Inc. subsidiary Qualcomm Technologies Inc. and STATS ChipPAC has been created to focus developing the foundation for low-cost interposers for 2.5D ICs.

Dim-Lee Kwong, executive director of IME commented: "2.5D/3D IC technology provides ample opportunities to further increase functionality and performance of semiconductor ICs. A collaborative approach is necessary for the industry to harness 2.5D/3D IC technologies successfully." "IME's consortium with Qualcomm Technologies and STATS ChipPAC focuses on pushing forward cost-effective manufacturing approaches in a timely manner," he added.

Jim Lederer, executive vice president and general manager of Qualcomm Technologies, believes that the initiative extends Qualcomm's R&D efforts in 2.5D and 3D technologies and shows how invested they are in the advancement of silicon technology.

"We are pleased to be part of this consortium to develop 2.5D technology solutions to address issues related to high volume manufacturing of 2.5D interposers," said Han Byung Joon, executive vice president and chief technology officer of STATS ChipPAC. "This collaboration, in conjunction with STATS ChipPAC's proven expertise in manufacturing 2.5D/3D ICs, expands our strategic relationship with Qualcomm Technologies and IME," Joon said.

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