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Chip-scale Schottky promises twice the power density

11 Jun 2013

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Diodes Inc. has unleashed what it touts as its first wafer-level, chip-scale packaged Schottky diode. According to the company, the SDM0230CSP provides smartphone and tablet designs with an alternative to miniature DFN0603-packaged devices, while offering twice the power density in the same PCB footprint.

In the X3-WLCUS0603-3 solder pad package, the 30V, 0.2A SDM0230CSP Schottky diode has a typical thermal resistance of just 261°C/W. This is around half that of the DFN0603 package so power dissipation is doubled in switching, reverse-blocking and rectification circuits.

Using 70 per cent less board space than the industry-standard DFN1006 and SOD923 packaged Schottkys, the 0.18mm2 footprint SDM0230CSP is aimed at high-density design. Additionally, its 0.3mm off board profile is 25 per cent thinner, benefiting ultra-thin portable products, added Diodes.

The Schottky's low maximum forward voltage of just 0.5V for a forward current of 0.2A, combined with a typical low leakage current of only 1.5mA at a reverse voltage of 30V, means it minimises power losses, thus extending battery life, the company noted.




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