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300mm, 450mm SEMI compliant loadports

05 Jul 2013

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TDK Corporation has announced that it will feature Hybrid N2 Purge loadports at SEMICON West 2013.

The company's N2 purge loadports are designed to reduce wafer cross contamination between processes and oxidation. TDK Hybrid N2 Purge uses a combination of bottom and front door purge systems to maximise process and cost benefits to the Semiconductor FAB.

The TDK N2 front purge loadport, which is currently being qualified by leading process tool manufacturers, has boasts a large gas flow for fast purge, purge nozzles located inside the EFEM, and capability to maintain low humidity and low particles inside the FOUP. Front purge uses existing FOUPs and no mass flow controller is required for front N2 purge.

N2 bottom purge uses semi compliant N2 purge FOUPs. The FOUP door may be closed during N2 bottom purge. Nitrogen purge is found to be effective to improve Cu interconnect reliability. With the demands of ITRS for smaller nodes, TDK Corporation with over 10 years' experience with N2 purge systems is working to meet the market requirements with innovative mini environment solutions.

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