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STATS ChipPAC taps NTU for semiconductor packaging R&D

15 Aug 2013

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Semiconductor packaging and test services company STATS ChipPAC Ltd. is teaming up with Nanyang Technological University in Singapore for research and development of new products related to wafer level packaging and interconnect technologies.

"We are excited to collaborate with NTU to harness semiconductor technologies that will drive the next generation of electronic devices," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

The partnership is in full alignment with STATS ChipPAC's on-going commitment to Singapore as the Company's global hub for advanced wafer level technology research and development, and Post Wafer fab Process (PWfP) for advanced mobile convergence devices.

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