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Ams adds 3D IC equipment at Austrian facility

04 Sep 2013

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Ams, a company that develops and manufactures high-performance analogue ICs and sensors, is upgrading its wafer fabrication plant near Graz, Austria, with the addition of analogue 3D IC equipment expected to boost production capacity. The company spent more than $33.45 million on the equipment line, which will initially produce devices for the mobile phone and medical imaging markets when it becomes fully operational by year-end.

The additional production capacity comes in response to a surge in demand forecast for ICs fabricated with 3D IC integration technology, developed exclusively by Ams. The patented technology enables the design and production of radically improved IC packages that are smaller and offer better device performance than existing packages.

For instance, the Through-Silicon Via interconnects in 3D ICs from Ams can replace the bond wires in conventional single-die devices. For optical semiconductors, clear packaging requirements are eliminated to enable production of chip scale packages that are smaller, cheaper, and less vulnerable to electro-magnetic interference.

The Ams 3D IC process also enables the production of stacked-die devices. Two die produced in different processes (such as a photodiode die and a silicon signal-processing die) are bonded back-to-back to produce a monolithic stacked-die device. This can replace two separate packages, has a far smaller footprint, and features much shorter interconnects, resulting in improved performance and reduced electrical noise.

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