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Littelfuse adds packaging options for SP3012 series

12 Nov 2013

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Littelfuse has released two additional packaging options to its SP3012 Series TVS Diode Array portfolio. The devices, SP3012-03UTG (uDFN-6) and SP3012-04HTG (SOT23-6), are designed for protecting sensitive chipsets with high-speed data lines from external electrostatic discharge (ESD) events. The new devices provide up to 66 per cent greater clamping performance than other industry options, the company said. The devices can be used in ultrabooks, LCD TVs, set-top boxes, Ethernet switches, and others.

"With a dynamic resistance of just 0.4ohms, the SP3012-03UTG and SP3012-04HTG provide a much lower clamping voltage than other devices available in the industry, which helps to ensure more reliable equipment performance in the field," said Chad Marak, product line director, TVS Diode Arrays. "Additionally, their ultra-low capacitance minimises signal degradation so the design engineer doesn't have to trade off protection for system performance."

The devices boast ultra-low capacitance of 0.5pF minimises signal degradation and distortion for high-speed applications such as HDMI 1.3/1.4 and USB 2.0, USB 3.0, DisplayPort. They also offer very low dynamic resistance of 0.4Ω provides very low clamping voltages to protect sensitive high-speed chipsets. ESD capability is a minimum of ±12kV (contact) and ±25kV (air), which exceeds the highest level of the IEC61000-4-2 standard (Level 4). Small form factor packages simplify the PCB layout by allowing the traces to run directly underneath the device and save valuable board space.

Samples are available now and sample requests may be placed through authorised Littelfuse distributors worldwide. SP3012 Series TVS Diode Arrays are available in reels of 3,000.

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