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MediaTek, VIA Telecom collaborate for mobile SoC design

08 Jan 2014

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MediaTek has agreed to team up with VIA Telecom as part of a strategy to promote the integration of its CDMA2000 technology into the design of the new Worldmode mobile SoCs. VIA Telecom Chief Executive Ker Zhang said that the new chips are expected to be launched before the end of 2014.

The existing MediaTek SoCs include comprehensive wireless modem, connectivity and multimedia capabilities. The collaboration with VIA Telecom enables the next-generation MediaTek SoCs to include support for Worldmode global roaming of voice and data services across CDMA2000, LTE (TDD and FDD), DC-HSPA+, UMTS, TD-SCDMA and GSM/EDGE networks.

MediaTekWorldmode SOCs will support interoperability between CDMA2000 and LTE modes for the U.S. and China, with handover for seamless switching across both networks, depending on coverage. The SoCs will also be software upgradeable to support Voice over LTE once mobile network operators begin to roll out the technology.

MediaTek already uses VIA Telecom base band processors as a discrete part in its existing mobile reference designs. Incorporating CDMA2000 technology into new SOC designs will significantly reduce manufacturing costs and power consumption for mobile devices. Samples of MediaTekWorldmode SoCs will be available in the fourth quarter of this year and the first commercial devices are expected in the first half of 2015.

"Through the inclusion of CDMA2000, MediaTek completes its portfolio of wireless modem and RF technologies", said MohitBhushan, vice president and general manager of MediaTek Corporate Marketing USA. "It is an important milestone in MediaTek's progression to becoming a global supplier of mobile solutions."

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