Path: EDN Asia >> News Centre >> Industrial/Mil/Aero >> Imec, Besi R&D pact to focus on thermocompression bonding
Industrial/Mil/Aero Share print

Imec, Besi R&D pact to focus on thermocompression bonding

22 Jan 2014

Share this page with your friends

Research firm Imec and equipment supplier Besi announced that they intend to work together over research and development of a high-throughput thermocompression solution for narrow-pitch die-to-die and die-to-wafer bonding. The companies hope the thermocompression bonder will give way to the production of hybrid 3D, 2.5D and 2.5D/3D technology.

Advancement in 3D IC manufacturing has been hampered by the lack of a high-throughput automated process flow for narrow-pitch, high-accuracy die-to-die and die-to-wafer bonding. Flip chip and reflow soldering, which are currently combined for bonding, require lenient bonding accuracy on large bump pitches (around 150µm-50µm bump pitch). Bump pitches need to further scale down to 40µm-10µm to realise a sufficiently high performance. This needs high accuracy in bonding within the range of 1um-2um @3sigma. Thermocompression bonding is a method that enables this high bonding accuracy on narrow bump pitches, but it entails long cycle times due to temperature and pressure profiles and processing methods. Besi and Imec's partnership intends to address this obstacle.

"This collaboration will enable us to benchmark our Chameo tool to meet the industrial needs of the semiconductor industry, offering our customers a viable and effective solution for 2.5D/3D IC manufacturing," said Richard Blickman, CEO at Besi.

Want to more of this to be delivered to you for FREE?

Subscribe to EDN Asia alerts and receive the latest design ideas and product news in your inbox.

Got to make sure you're not a robot. Please enter the code displayed on the right.

Time to activate your subscription - it's easy!

We have sent an activate request to your registerd e-email. Simply click on the link to activate your subscription.

We're doing this to protect your privacy and ensure you successfully receive your e-mail alerts.

Add New Comment
Visitor (To avoid code verification, simply login or register with us. It is fast and free!)
*Verify code:
Tech Impact

Regional Roundup
Control this smart glass with the blink of an eye
K-Glass 2 detects users' eye movements to point the cursor to recognise computer icons or objects in the Internet, and uses winks for commands. The researchers call this interface the "i-Mouse."

GlobalFoundries extends grants to Singapore students
ARM, Tencent Games team up to improve mobile gaming

News | Products | Design Features | Regional Roundup | Tech Impact