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Photorelays reduce assembly area by half

09 Sep 2014

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Toshiba Corp. has unveiled four product additions, which tout the industry's smallest package, to its line-up of photorelays. The devices are targeted as system solutions for various applications including semiconductor testers, measurement equipment, probe cards and medical equipment.

The devices utilise Toshiba's proprietary VSON4 package, which reduces assembly area by 50 per cent and volume by 60 per cent compared to equivalent Toshiba products in a USOP4 package. The VSON4 packaging contributes to enhancing high-density assembly.

The devices feature unique improvements. TLP3440 has improved leakage characteristics against high frequency at off-state, while TLP3475 has superior high speed signal transmission characteristics at on-state. When it comes to high voltage measurement requirements including SoC testing, TLP3417 supports 80V, while TLP3420, 100V.

Other than the devices' distinct characteristics, they have the same electrical characteristics as the conventional Toshiba USOP4 series products, making them easier to evaluate as replacement products.

VSON4 package

VSON4 packaging and pin assignment. Source: Toshiba




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