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Lattice, Cypress partner to streamline USB 3.0 video bridges

11 Sep 2014

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Lattice Semiconductor Corp. and Cypress Semiconductor Corp. have announced what they describe as a low-cost development kit that offers a complete reference design for USB 3.0-enabled video bridges. According to the companies, the Lattice USB 3.0 video bridge development kit simplifies integration of USB 3.0 audio and high-definition (HD) video connectivity for a range of applications, leveraging the LatticeECP3 FPGA family and the Cypress EZ-USB FX3 USB 3.0 peripheral controller.

USB 3.0 delivers 5Gb/s bandwidth that enables streaming of HD video without requiring compression, which degrades image quality. The Lattice USB 3.0 video bridge development kit includes all of the hardware and software needed to develop USB 3.0 cameras, frame grabbers, machine vision systems, surveillance equipment and other audio/video USB 3.0 converter systems. With the LatticeECP3 FPGA, the kit supports high speed reception and packing of video and audio data into USB 3.0 UVC and UAC data frames without the use of external memory buffers. The kit leverages the flexibility of the FX3 solution to support parallel, MIPI CSI-2 and LVDS camera interfacing, as well as HDMI and SDI audio/video formats. The kit is available for purchase at the Lattice store.

Lattice USB 3.0 video bridge development kit

EZ-USB FX3 is the industry's only programmable USB 3.0 peripheral controller, stated the companies. It is equipped with a highly configurable General Programmable Interface (GPIF II), which can be programmed in 8, 16 and 32bit configurations. GPIF II allows FX3 to communicate directly with application processors, FPGAs, storage media and image sensors, and provides a data transfer rate of up to 400MB/s, while using lower power than alternative solutions. FX3 provides SuperSpeed USB 3.0 connectivity to virtually any system. The on-chip ARM9 CPU core with 512KB RAM delivers 200 MIPS of computational power and is available for applications that require local data processing. Additionally, FX3 provides SPI, UART, I2C and I2S interfaces to connect to serial peripherals. In short, FX3 provides highly flexible and integrated features that enable developers to add USB 3.0 connectivity to any system, the companies noted.

EZ-USB FX3 is in volume production and is available in two packages: a 121-ball BGA (10 x 10mm) and a space saving 131-ball wafer-level chip scale package (WLCSP) with dimensions of 4.7 x 5.1mm.




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