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Snapshots of DesignCon 2015

02 Feb 2015  | EDN Staff

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TE Connectivity's CoolBit MidBoard optics modules have 10.8 Terabits packaging density in these 36×300Gbs modules, shown here connected to the orange and blue fibre-optic flat cables.


Wurth Electronics showed off their array of various Qi Wireless Power Charging Coils shown here in the foreground. Their coil designs are optimised for maximum power transfer through the air.


Teledyne Lecroy showed off its Motor Drive Power Analyser to a crowded vendor session.


And here's the Motor Drive Power Analyser in action.


Scott McMorrow of Teraspeed Consulting demonstrated a 28Gbit/s backplane that uses Samtec Connectors, powered by two Xilinx FPGA boards.


Vector-network analysers such as this one from Keysight Technologies display plots showing the frequency response of high-speed boards and backplanes.

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