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Intel unveils LTE-integrated chips for tablets

03 Mar 2015  | Jessica Lipsky

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"This is beginning of [the Sofia] family in earnest as we promised. There is nothing that stops the X5 line from being available in smartphones," Evans said. "Right now you will see the focus on tablets and that segment, given the chip's graphics performance."

A third generation LTE modem was announced alongside the new Atom line, with the first commercial devices expected in the second half of 2015. Intel's XMM 7360 modem supports 29 LTE bands with CAT-9 and CAT-10 carrier aggregation, and is capable of up to 300Mbit/s downlink and 50Mbit/s uplink.

"The modem comes with [IEEE 802.11ac], GNSS/GPS, and NFC all integrated so customers can get to market very quickly," Evans said. This connectivity will also be in the higher-end X3 chips.

Evans said she will not be satisfied until the company is one of the top two or three players in the space and "absolutely driving the conversation in mobile."

"I'm not pleased, there's nothing to be pleased about," she said, adding that Intel shipped a few million ICs, discrete solutions and modems last year. "It's still lower than we wanted. But this is a very tough market. We've been very, very diligent in establishing a foundation...we think history is going to be on our side given the plethora of assets needed."

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