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Benchtop systems aimed at temperature testing ICs

23 Jul 2015  | Julien Happich

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inTEST Thermal Solutions has announced a couple of benchtop systems for temperature testing ICs including high-Watt emitting devices. The Temptronic ThermoSpot consists of a highly responsive benchtop temperature forcing unit that feeds a thermal probe head through a flexible umbilical.

The thermal probe is designed with interchangeable thermal heads to mate directly to an IC or other device under test creating a highly efficient thermally conductive path to quickly induce temperatures to the device, even under power.

Temptronic ThermoSpot

Interfacing to the DUT is available for in-circuit and test socket applications. Connecting the thermal head to the DUT is made easy and precise through a quick lock-down mechanism on the thermal head. Two models, DCP-1 and DCP-2, span a temperature range from -65°C to 200°C.

The DCP-1 provides cooling power of 25W at -40°C for lower power devices, while the DCP-2 provides a capacity to cool 55W at -55°C and 120W at -40°C. A touch-screen controller permits user-programmable temperatures, graphing, data logging and more. Using DUT control, with a thermocouple or diode, the system provides fast and precise transitions to temperature at the IC.

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