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Firmware optimises Teseo navigation ICs

29 Sep 2015

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TESEO IC

Aiming to bring accurate positioning to next-generation satellite navigation, STMicroelectronics has loaded the new Teseo Draw firmware with its Teseo III automotive-navigation ICs.

The Draw firmware for 3D positioning chips enables navigation devices to provide continuous, accurate location and turn-by-turn instructions even when satellite signals are poor or unavailable in tunnels, covered car parks, multi-level highways or urban canyons.

The Draw firmware merges satellite information with data from vehicle sensors such as the gyroscope, accelerometer and wheel-speed sensors to calculate location accurately in three dimensions including elevation. If the satellite signal is poor, Draw compensates for the loss of accuracy, and if the signal becomes unavailable, navigation continues uninterrupted based on calculated location (dead reckoning).

Road tests carried out by ST in difficult undercover and urban environments have demonstrated continuous tracking from entry to exit in complex multi-level car parks, and at street level between tall buildings, where conventional systems have been unable to track the vehicle.

GNSS1 has revolutionised activities such as commercial logistics, asset management, and personal mobility. Over four billion GNSS devices are now in use worldwide2. By enabling high-accuracy 3D dead reckoning, Draw expands the opportunities for developers to commercialise new applications.

TESEO DRAW

The new Teseo firmware has multiple modes and is capable of referring to sensors on the vehicle's CAN bus or discrete sensors such as the odometer, reverse sensor, MEMS accelerometer and gyroscope, or MEMS inertial module connected to the Teseo III IC.

Teseo III ICs loaded with the Draw firmware are sampling now and will enter mass production in Q1 2016.




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