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Translator eliminates complex interfaces in motor driver IC

28 Mar 2016

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Massachusetts-based Allegro Microsystem has introduced a motor driver IC equipped with a built-in translator to operate bipolar stepper motors from full-step up to 1/32 step modes selectable by MSx logic inputs. Operating with a single supply, the 45984 integrated bipolar stepper motor driver IC has an output drive capacity of up to 40V and ±2A and operates with a single supply.

It is targeted at the office and industrial automation markets with key applications to include: automatic teller machines, point of sale and laser printers, 3D printers, copiers, CCTV, cameras, sewing machines, vending, and robotics.

The A5984 motor driver IC introduces a proprietary Adaptive Per cent Fast Decay (APFD) algorithm to optimise the current waveform over a wide range of stepper speeds and stepper motor characteristics. APFD adjusts, on-the-fly, the amount of fast decay with the goal of maintaining current regulation while minimising current ripple. This adaptive feature improves performance of the system resulting in reduced audible motor noise, reduced vibration, and increased step accuracy. The translator is the key to the easy implementation of the A5984. Inputting one pulse on the STEP input drives the motor one microstep. There are no phase sequence tables, high frequency control lines, or complex interfaces to program. The interface works for applications where a complex microprocessor is unavailable.


Figure 1: A5984 motor driver IC introduces a proprietary Adaptive Per cent Fast Decay (APFD) algorithm.

Internal synchronous rectification control circuitry is provided for power dissipation during PWM operation. Internal circuit protection included: Overcurrent protection for motor lead short to ground or supply, thermal shutdown with hysteresis, under-voltage lockout (UVLO), and crossover-current protection. Power-on sequencing is not required.

The A5984 is supplied in three surface mount packages: two QFN packages—the 4mm × 4mm, 0.75mm nominal overall height ES package and a 5mm × 5mm × 0.90mm ET package. It is also available in a 24-pin TSSOP LP package. All three packages have exposed pads for enhanced thermal dissipation and are lead (Pb) free (suffix –T), with 100% matte-tin-plated leadframes.

The ET package meets customer requirements for no smoke no fire (NSNF) designs by adding no-connect pins between critical output, sense, and supply pins. So, in the case of a pin-to-adjacent-pin short, the device does not cause smoke or fire. Additionally, the device does not cause smoke or fire when any pin is shorted to ground or left open.

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